This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RNA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:

        Device type          Generic number               Circuit function              01                  79R3081E                 32-bit RISC microprocessor

The device class designator shall be a single letter identifying the product assurance level as follows:

        Device class                    Device requirements documentation              M            Vendor self-certification to the requirements for non-JAN class B                           microcircuits in accordance with 1.2.1 of MIL-STD-883             Q or V         Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

        Outline letter            Descriptive designator        Terminals      Package style               X                      See figure 1                   84         Quad flat pack

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature range . . . . . . . . . . . . . . . . . . .   −65°C to +155°C Maximum power dissipation (PD)  . . . . . . . . . . . . . . . .    4.2 W Terminal voltage with respect to GND range (VTERM) . . . . . .    −0.5 V dc to +7.0 V dc Input voltage range (VIN)  . . . . . . . . . . . . . . . . . .    −0.5 V dc to +7.0 V dc Temperature under bias range (TBIAS) . . . . . . . . . . . . .    −65°C to +135°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . .     260°C Thermal resistance, junction-to-case (ΘJC):  . . . . . . . . .     10°C/W Junction temperature (TJ)  . . . . . . . . . . . . . . . . . .     +175°C

Case operating temperature range . . . . . . . . . . . . . . .    −55°C to +125°C Supply voltage range . . . . . . . . . . . . . . . . . . . . .     4.50 V dc ≤ VCC ≤ 5.50 V dc

  Fault coverage measurement of manufacturing     logic tests (MIL-STD-883, test method 5012)  . . . . . . . . .     XX percent 2/

Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device class Q devices will replace device class M devices.