IPC TM-650 2.3.38C

Abstract

This test method is for use in determining if organic, nonionic contaminants are present on bare printed wiring board, and completed assembly surfaces in the production area by limited technical personnel. Although the test fluid is also capable of dissolving very small amounts of various inorganic compounds, their presence would generally be masked by the much higher levels of the organic contaminants. 1.2 The test will neither identify the contaminants present nor separate contaminant mixtures into the individual constituents (see Test Method 2.3.39). The present visual limit of organic contaminant detection by this method is approximately 10 micrograms/cm2.