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IPC TM-650 2.4.44
Solder Paste - Tack Test
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:03:19Z | |
| date available | 2017-09-04T17:03:19Z | |
| date copyright | 01/01/1995 (R 1998) | |
| date issued | 1998 | |
| identifier other | XWRRCAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/126872 | |
| description abstract | This test is to determine the ability of a printed pattern of solder paste to retain a probe placed in the solder paste by measuring the force required to separate the probe from the paste. Time between printing and probe placement are progressively increased to simulate variables in a manufacturing process. | |
| language | English | |
| title | IPC TM-650 2.4.44 | num |
| title | Solder Paste - Tack Test | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1998 | |
| contenttype | fulltext |
