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Thermal Stress, Convection Reflow Assembly Simulation

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:09:13Z
date available2017-09-04T17:09:13Z
date copyright05/01/2009
date issued2009
identifier otherYMGMMCAAAAAAAAAA.pdf
identifier urihttps://lib.yabesh.ir/std/handle/yse/132691
description abstractThis method shall be used to simulate exposure to the thermal conditions of convection reflow assembly.
Purpose This method shall be used to replicate the thermodynamic effects of assembly on the test specimen. The use of this method in accordance with the requirements defined herein shall cover those effects that are the result of convection reflow assembly, rework or repair.
This method shall be used for qualification testing of an applicable test specimen. The evaluation of acceptability for qualification shall be in accordance with the requirements defined in 5.3.
This method may be used for lot acceptance.The evaluation for lot acceptability should be in accordance with the requirements defined in 5.3 or as agreed upon between user and supplier (AABUS).
languageEnglish
titleIPC TM-650 2.6.27num
titleThermal Stress, Convection Reflow Assembly Simulationen
typestandard
page8
statusActive
treeIPC - Association Connecting Electronics Industries:;2009
contenttypefulltext


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