IPC TM-650 2.6.9.2

Abstract

The purpose of this test method is to provide a consistent procedure to test the sensitivity of electronic components to ultrasonic energy. There has been reluctance in the electronics industry to use ultrasonic energy for printed board assembly cleaning because of the possibility of damage to wire bonds in active, hermetically sealed components or other damage that might cause latent failures. Recent work has shown that electronic components have a low potential for damage from ultrasonics (References 1-7) under conditions seen in most cleaning processes. In addition, MIL-STD-2000 Rev. A and J-STD-001 now allow for the use of ultrasonic cleaning, as does the proposal for IEC TC91 International Standards based on an updated revision of the J-STD-001.