IPC TR-579

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T17:18:03Z
date available	2017-09-04T17:18:03Z
date copyright	09/01/1988
date issued	1988
identifier other	ZJWXCAAAAAAAAAAA.pdf
identifier uri	https://lib.yabesh.ir/std/handle/yse/141404
description abstract	Objective The "Round Robin Reliability Evaluation of Small Diameter Plated Through Holes (PTH) in Printed Wiring Boards" had the following objectives: • Evaluate the performance of small diameter PTHs under controlled environmental conditlons. • Evaluate the influence of the thickness and quality of deposited copper on PTH performance. • Determlne the impact of varying PTH aspect ratios. • Collect data on the influence of product design or manufacturing methods. • Determine if test results from different military and industrial thermal cycle and/or thermal shock procedures can be correlated.
language	English
title	IPC TR-579	num
title	Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards	en
type	standard
page	90
status	Active
tree	IPC - Association Connecting Electronics Industries:;1988
contenttype	fulltext