درباره ما
IPC TM-650 2.3.31
Relative Degree of Cure in U.V. Curable Materials
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:18:09Z | |
| date available | 2017-09-04T17:18:09Z | |
| date copyright | 02/01/1988 | |
| date issued | 1988 | |
| identifier other | ZKDJCAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/141497 | |
| description abstract | This test method is designed to determine relative degree of cure in liquid U.V. curable materials such as etch resists, plating resists and solder masks. It is not applicable to dry film products nor to solvent-based thermal cure products. | |
| language | English | |
| title | IPC TM-650 2.3.31 | num |
| title | Relative Degree of Cure in U.V. Curable Materials | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1988 | |
| contenttype | fulltext |
