MIL-PRF-914/5B (2)
RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 16-PIN, LEADLESS CHIP CARRIER, NONESTABLISHED RELIABILITY AND ESTABLISHED RELIABILITY, STYLE RNS050
Organization:
ARMY - CR - US Army Communications Electronics Command
Year: 2010
Abstract: This specification covers the associated requirements for RNS050 resistor networks. Resistors covered by this specification are considered a monolithic design or wire bond and die construction. The established reliability (ER) and nonestablished reliability (non-ER) styles are available in all characteristics and resistance tolerances. Designers are CAUTIONED on using these resistors in pulse applications (see 6.6).Intended Use: Resistor networks are used in surface mount applications where space is a major concern.
Subject: Wire bond and die construction
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MIL-PRF-914/5B (2)
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contributor author | ARMY - CR - US Army Communications Electronics Command | |
date accessioned | 2017-09-04T17:18:56Z | |
date available | 2017-09-04T17:18:56Z | |
date copyright | 02/05/2010 | |
date issued | 2010 | |
identifier other | ZMBGQCAAAAAAAAAA.pdf | |
identifier uri | https://lib.yabesh.ir/std/handle/yse/142187 | |
description abstract | This specification covers the associated requirements for RNS050 resistor networks. Resistors covered by this specification are considered a monolithic design or wire bond and die construction. The established reliability (ER) and nonestablished reliability (non-ER) styles are available in all characteristics and resistance tolerances. Designers are CAUTIONED on using these resistors in pulse applications (see 6.6).Intended Use: Resistor networks are used in surface mount applications where space is a major concern. | |
language | English | |
title | MIL-PRF-914/5B (2) | num |
title | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 16-PIN, LEADLESS CHIP CARRIER, NONESTABLISHED RELIABILITY AND ESTABLISHED RELIABILITY, STYLE RNS050 | en |
type | standard | |
page | 7 | |
status | Active | |
tree | ARMY - CR - US Army Communications Electronics Command:;2010 | |
contenttype | fulltext | |
subject keywords | Wire bond and die construction |