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Solder Mask - Hydrolytic Stability

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:24:59Z
date available2017-09-04T17:24:59Z
date copyright03/01/2007
date issued2007
identifier otherCGHVACAAAAAAAAAA.pdf
identifier urihttps://lib.yabesh.ir/std/handle/yse/148083
description abstractThis test method is used to determine the resistance of the applied solder mask to reverting to liquid when exposed to high humidity at a specific time and temperature condition. This test method evaluates the stability of a cured solder mask that has been applied to a printed board under storage (nonoperating) conditions.
languageEnglish
titleIPC TM-650 2.6.11Dnum
titleSolder Mask - Hydrolytic Stabilityen
typestandard
page1
statusActive
treeIPC - Association Connecting Electronics Industries:;2007
contenttypefulltext


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