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IPC TM-650 2.6.11D
Solder Mask - Hydrolytic Stability
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:24:59Z | |
| date available | 2017-09-04T17:24:59Z | |
| date copyright | 03/01/2007 | |
| date issued | 2007 | |
| identifier other | CGHVACAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/148083 | |
| description abstract | This test method is used to determine the resistance of the applied solder mask to reverting to liquid when exposed to high humidity at a specific time and temperature condition. This test method evaluates the stability of a cured solder mask that has been applied to a printed board under storage (nonoperating) conditions. | |
| language | English | |
| title | IPC TM-650 2.6.11D | num |
| title | Solder Mask - Hydrolytic Stability | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2007 | |
| contenttype | fulltext |
