IPC J-STD-006C

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T17:25:09Z
date available	2017-09-04T17:25:09Z
date copyright	07/01/2013
date issued	2013
identifier other	CGXYFFAAAAAAAAAA.pdf
identifier uri	https://lib.yabesh.ir/std/handle/yse/148293
description abstract	This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering applications; and for ‘‘special form'' (see 1.2.3) electronic grade solders. This is a quality control standard and is not intended to relate directly to the material's performance in the manufacturing process. Solders for applications other than electronics should be procured using ASTM B-32. This standard is one of a set of three joint industry standards that prescribe the requirements and test methods for soldering materials for use in the electronics industry. The other two joint industry standards are: J-STD-004 Requirements for Soldering Fluxes -STD-005 Requirements for Soldering Pastes
language	English
title	IPC J-STD-006C	num
title	Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications	en
type	standard
page	36
status	Active
tree	IPC - Association Connecting Electronics Industries:;2013
contenttype	fulltext