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IPC TM-650 2.3.27.1
Rosin Flux Residue Analysis - HPLC Method
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:35:51Z | |
| date available | 2017-09-04T17:35:51Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | DIZWCAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/158727 | |
| description abstract | This High Performance Liquid Chromatography (HPLC) procedure outlines the analysis of rosin flux residues remaining on a printed wiring board (PWB) after defluxing. This test can be used for the evaluation of processes used to clean rosin based soldering fluxes. | |
| language | English | |
| title | IPC TM-650 2.3.27.1 | num |
| title | Rosin Flux Residue Analysis - HPLC Method | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |
