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IPC TM-650 2.6.7A
Thermal Shock & Continuity, Printed Board
Organization:
IPC - Association Connecting Electronics Industries
Year: 1997
Abstract: The purpose of this method is to determine the physical endurance of printed boards to sudden exposure to extreme changes in temperature and the effect of alternate exposures to these extremes. The exposure of the printed board specimens to the high and low temperature extremes is designed to cause physical damage, deterioration, or significant changes in resistance.
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IPC TM-650 2.6.7A
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:38:13Z | |
| date available | 2017-09-04T17:38:13Z | |
| date copyright | 08/01/1997 | |
| date issued | 1997 | |
| identifier other | DPGECAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/161161 | |
| description abstract | The purpose of this method is to determine the physical endurance of printed boards to sudden exposure to extreme changes in temperature and the effect of alternate exposures to these extremes. The exposure of the printed board specimens to the high and low temperature extremes is designed to cause physical damage, deterioration, or significant changes in resistance. | |
| language | English | |
| title | IPC TM-650 2.6.7A | num |
| title | Thermal Shock & Continuity, Printed Board | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1997 | |
| contenttype | fulltext |