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IPC TM-650 2.4.42
Torsional Strength of Chip Adhesives
Organization:
IPC - Association Connecting Electronics Industries
Year: 1988
Abstract: This procedure establishes the performance and test guidelines for the break-off torque of adhesives used by placement equipment to attach surface mounted devices to printed wiring boards.
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IPC TM-650 2.4.42
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:41:21Z | |
| date available | 2017-09-04T17:41:21Z | |
| date copyright | 02/01/1988 | |
| date issued | 1988 | |
| identifier other | DXTWCAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/164379 | |
| description abstract | This procedure establishes the performance and test guidelines for the break-off torque of adhesives used by placement equipment to attach surface mounted devices to printed wiring boards. | |
| language | English | |
| title | IPC TM-650 2.4.42 | num |
| title | Torsional Strength of Chip Adhesives | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1988 | |
| contenttype | fulltext |