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MIL-PRF-914/3B (2)
RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 16-PIN, LEADLESS CHIP CARRIER, NONESTABLISHED RELIABILITY AND ESTABLISHED RELIABILITY, STYLE RNS030
Organization:
ARMY - CR - US Army Communications Electronics Command
Year: 2009
Abstract: This specification covers the associated requirements for RNS030 resistor networks. Resistors covered by this specification are considered a monolithic design or wire bond and die construction. The established reliability (ER) and nonestablished reliability (non-ER) styles are available in all characteristics, and resistance tolerances. Designers are CAUTIONED on using these resistors in pulse applications.Intended Use: Resistor networks are used in surface mount applications where space is a major concern.
Subject: Wire bond and die construction
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MIL-PRF-914/3B (2)
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| contributor author | ARMY - CR - US Army Communications Electronics Command | |
| date accessioned | 2017-09-04T17:42:17Z | |
| date available | 2017-09-04T17:42:17Z | |
| date copyright | 40150 | |
| date issued | 2009 | |
| identifier other | EAHLPCAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/165316 | |
| description abstract | This specification covers the associated requirements for RNS030 resistor networks. Resistors covered by this specification are considered a monolithic design or wire bond and die construction. The established reliability (ER) and nonestablished reliability (non-ER) styles are available in all characteristics, and resistance tolerances. Designers are CAUTIONED on using these resistors in pulse applications.Intended Use: Resistor networks are used in surface mount applications where space is a major concern. | |
| language | English | |
| title | MIL-PRF-914/3B (2) | num |
| title | RESISTOR NETWORK, FIXED, FILM, SURFACE MOUNT, 16-PIN, LEADLESS CHIP CARRIER, NONESTABLISHED RELIABILITY AND ESTABLISHED RELIABILITY, STYLE RNS030 | en |
| type | standard | |
| page | 8 | |
| status | Active | |
| tree | ARMY - CR - US Army Communications Electronics Command:;2009 | |
| contenttype | fulltext | |
| subject keywords | Wire bond and die construction |