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IPC J-STD-013
Implementation of Ball Grid Array and Other High Density Technology
Organization:
IPC - Association Connecting Electronics Industries
Year: 1996
Abstract: This document establishes the requirements and interactions necessary for Printed Board Assembly processes for interconnecting high performance/ high pin count I/C packages. Included is information on design principles, material selection, board fabrication, assembly technology, testing strategy, and reliability expectations based on end-use environments.
The focus of the document is on design through testing issues related to Ball Grid Array and other high performance packages including fine pitch, ultra fine pitch and thru-hole PGA.
Purpose
The purpose of this document is to provide confidence in the Design through Testing processes to ensure that the final assembly will meet the intended goals for product performance. Reliability is established through end use environments that consider the performance requirements of assemblies that are used in electronic products in such markets as consumer, computer, telecommunication, commercial aircraft, industrial & automotive passenger compartment, military ground & ship, space (both LEO and GEO), military avionics, and automotive underhood electronics and the customary use of those equipments.
The focus of the document is on design through testing issues related to Ball Grid Array and other high performance packages including fine pitch, ultra fine pitch and thru-hole PGA.
Purpose
The purpose of this document is to provide confidence in the Design through Testing processes to ensure that the final assembly will meet the intended goals for product performance. Reliability is established through end use environments that consider the performance requirements of assemblies that are used in electronic products in such markets as consumer, computer, telecommunication, commercial aircraft, industrial & automotive passenger compartment, military ground & ship, space (both LEO and GEO), military avionics, and automotive underhood electronics and the customary use of those equipments.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:45:41Z | |
| date available | 2017-09-04T17:45:41Z | |
| date copyright | 07/01/1996 | |
| date issued | 1996 | |
| identifier other | EJPZCAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/168805 | |
| description abstract | This document establishes the requirements and interactions necessary for Printed Board Assembly processes for interconnecting high performance/ high pin count I/C packages. Included is information on design principles, material selection, board fabrication, assembly technology, testing strategy, and reliability expectations based on end-use environments. The focus of the document is on design through testing issues related to Ball Grid Array and other high performance packages including fine pitch, ultra fine pitch and thru-hole PGA. Purpose The purpose of this document is to provide confidence in the Design through Testing processes to ensure that the final assembly will meet the intended goals for product performance. Reliability is established through end use environments that consider the performance requirements of assemblies that are used in electronic products in such markets as consumer, computer, telecommunication, commercial aircraft, industrial & automotive passenger compartment, military ground & ship, space (both LEO and GEO), military avionics, and automotive underhood electronics and the customary use of those equipments. | |
| language | English | |
| title | IPC J-STD-013 | num |
| title | Implementation of Ball Grid Array and Other High Density Technology | en |
| type | standard | |
| page | 103 | |
| status | Withdrawn | |
| tree | IPC - Association Connecting Electronics Industries:;1996 | |
| contenttype | fulltext |