IPC TM-650 2.4.9.1
Peel Strength of Flexible Circuits
contributor author | IPC - Association Connecting Electronics Industries | |
date accessioned | 2017-09-04T17:47:49Z | |
date available | 2017-09-04T17:47:49Z | |
date copyright | 36100 | |
date issued | 1998 | |
identifier other | EPRXHAAAAAAAAAAA.pdf | |
identifier uri | https://lib.yabesh.ir/std/handle/yse/171063 | |
description abstract | The purpose of this test is to characterize peel adhesion at ambient conditions. | |
language | English | |
title | IPC TM-650 2.4.9.1 | num |
title | Peel Strength of Flexible Circuits | en |
type | standard | |
page | 1 | |
status | Active | |
tree | IPC - Association Connecting Electronics Industries:;1998 | |
contenttype | fulltext |