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IPC TM-650 2.4.49
Solder Pool Test
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:13:14Z | |
| date available | 2017-09-04T18:13:14Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | HEISCAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/196174 | |
| description abstract | This solder pool test method provides a measurement of wetting characteristics of flux on/in flux-coated and/or flux-cored solder. | |
| language | English | |
| title | IPC TM-650 2.4.49 | num |
| title | Solder Pool Test | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |
