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IPC TM-650 2.6.7.2B
Thermal Shock, Continuity and Microsection, Printed Board
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:13:37Z | |
| date available | 2017-09-04T18:13:37Z | |
| date copyright | 05/01/2004 | |
| date issued | 2004 | |
| identifier other | HFPHFBAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/196609 | |
| description abstract | This method is to determine the physical endurance of printed boards to sudden changes of temperature. It is designed to expose specimens to a series of high and low temperature excursions to cause physical fatigue. | |
| language | English | |
| title | IPC TM-650 2.6.7.2B | num |
| title | Thermal Shock, Continuity and Microsection, Printed Board | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |
