IPC TM-650 2.1.1F

Abstract

This method is to be used as a guideline for preparing a metallographic specimen of printed boards. The finished microsection is used for evaluating the quality of the laminate system and plated structures (plated-through holes, solder joints, vias, etc.). The plated structures can be evaluated for characteristics of the copper foils, plating, and/or coatings to determine compliance with applicable performance specification requirements. <br>Metallographic sample preparation is regarded by many as essentially a highly developed skill; this method describes those techniques that have been found to be generally acceptable. It does not attempt to be so specific as to not allow acceptable variations that can differentiate metallographers. Furthermore, the success of these techniques remains highly dependent upon the skill of the individual metallographer. <br><strong>Note</strong>: These microsection techniques are processes and are intended as guidelines and thus variations are allowed. <br><strong>Note</strong>: The use of the materials listed in Section 4 may be limited or forbidden in some environments. Please review the Safety Data Sheet (SDS) for the materials being used.&#160; <br><strong>Method A (Manual) Description</strong> Manual metallographic preparation of sample(s).&#160; <br><strong>Method B (Semi or Automatic) Description</strong> Semi or automatic metallographic preparation utilizing dedicated microsection equipment to prepare multiple samples.