IPC 2223C

Sectional Design Standard for Flexible Printed Boards

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T18:17:44Z
date available	2017-09-04T18:17:44Z
date copyright	40848
date issued	2011
identifier other	HPUPREAAAAAAAAAA.pdf
identifier uri	https://lib.yabesh.ir/std/handle/yse/200505
description abstract	This standard establishes the specific requirements for the design of flexible printed circuit applications and its forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced, dielectric in combination with metallic materials. These interconnecting boards may contain single, double, multilayer, or multiple conductive layers and can be comprised wholly of flex or a combination of both flex and rigid. Purpose The requirements contained herein are intended to establish specific design details that shall be used in conjunction with IPC-2221 and may also be used in conjunction with IPC-2222 for the rigid sections of rigid-flex circuits.
language	English
title	IPC 2223C	num
title	Sectional Design Standard for Flexible Printed Boards	en
type	standard
page	52
status	Active
tree	IPC - Association Connecting Electronics Industries:;2011
contenttype	fulltext