درباره ما
IPC D-355
Printed Board Assembly Description in Digital Form
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: This standard is used to describe the relationship between components (electronic, electro-mechanical, and mechanical) and the printed boards used as the major form of interconnection. Included in these descriptions are the physical characteristics of components and boards required as input to an automated assembly system. The physical characteristics used in the electronic design process shall be described in digital form, in order to enable the data exchange and archiving capability between systems which support design, fabrication, assembly and testing. This structure provides the capability for describing all elements in their final form upon completion of manufacturing. It may be used for component preparation (sequencing, lead bonding, etc.), component insertion, adhesive application and component placement.
Collections
:
Show full item record
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:43:48Z | |
| date available | 2017-09-04T16:43:48Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | VVIQCAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/107129 | |
| description abstract | This standard is used to describe the relationship between components (electronic, electro-mechanical, and mechanical) and the printed boards used as the major form of interconnection. Included in these descriptions are the physical characteristics of components and boards required as input to an automated assembly system. The physical characteristics used in the electronic design process shall be described in digital form, in order to enable the data exchange and archiving capability between systems which support design, fabrication, assembly and testing. This structure provides the capability for describing all elements in their final form upon completion of manufacturing. It may be used for component preparation (sequencing, lead bonding, etc.), component insertion, adhesive application and component placement. | |
| language | English | |
| title | IPC D-355 | num |
| title | Printed Board Assembly Description in Digital Form | en |
| type | standard | |
| page | 40 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |