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IPC TM-650 2.3.27
Cleanliness Test - Residual Rosin
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: To quantify the residual rosin left from solder paste and/or wave soldering flux after the reflow and cleaning process.
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IPC TM-650 2.3.27
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:49:19Z | |
| date available | 2017-09-04T16:49:19Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | WKQUCAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/112812 | |
| description abstract | To quantify the residual rosin left from solder paste and/or wave soldering flux after the reflow and cleaning process. | |
| language | English | |
| title | IPC TM-650 2.3.27 | num |
| title | Cleanliness Test - Residual Rosin | en |
| type | standard | |
| page | 5 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |