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IPC TM-650 2.4.1.3
Adhesion, Resistors (Hybrid Circuits)
Organization:
IPC - Association Connecting Electronics Industries
Year: 1987
Abstract: This test method is to determine the adhesion quality of resistive and capacitive materials on the substrate surface of finished hybrid circuits.
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IPC TM-650 2.4.1.3
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T16:59:41Z | |
| date available | 2017-09-04T16:59:41Z | |
| date copyright | 32112 | |
| date issued | 1987 | |
| identifier other | XMLXCAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/123108 | |
| description abstract | This test method is to determine the adhesion quality of resistive and capacitive materials on the substrate surface of finished hybrid circuits. | |
| language | English | |
| title | IPC TM-650 2.4.1.3 | num |
| title | Adhesion, Resistors (Hybrid Circuits) | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1987 | |
| contenttype | fulltext |