IPC TR-476A

Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T17:00:24Z
date available	2017-09-04T17:00:24Z
date copyright	05/01/1997
date issued	1997
identifier other	XOJDCAAAAAAAAAAA.pdf
identifier uri	https://lib.yabesh.ir/std/handle/yse/123856
description abstract	This technical report discusses the reasons and the test methods available for electrically induced failures on printed wiring board surfaces and sub-surfaces caused by a combination of voltage potential, electrical field, temperature, humidity, and contamination. Solid State electromigration is discussed to differentiate from electrochemical migration phenomena. This document does not cover non-electrically-driven diffusion phenomena nor stress-induced whisker growth.
language	English
title	IPC TR-476A	num
title	Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies	en
type	standard
page	68
status	Active
tree	IPC - Association Connecting Electronics Industries:;1997
contenttype	fulltext