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IPC TR-476A
Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies
Organization:
IPC - Association Connecting Electronics Industries
Year: 1997
Abstract: This technical report discusses the reasons and the test methods available for electrically induced failures on printed wiring board surfaces and sub-surfaces caused by a combination of voltage potential, electrical field, temperature, humidity, and contamination.
Solid State electromigration is discussed to differentiate from electrochemical migration phenomena. This document does not cover non-electrically-driven diffusion phenomena nor stress-induced whisker growth.
Solid State electromigration is discussed to differentiate from electrochemical migration phenomena. This document does not cover non-electrically-driven diffusion phenomena nor stress-induced whisker growth.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:00:24Z | |
| date available | 2017-09-04T17:00:24Z | |
| date copyright | 05/01/1997 | |
| date issued | 1997 | |
| identifier other | XOJDCAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/123856 | |
| description abstract | This technical report discusses the reasons and the test methods available for electrically induced failures on printed wiring board surfaces and sub-surfaces caused by a combination of voltage potential, electrical field, temperature, humidity, and contamination. Solid State electromigration is discussed to differentiate from electrochemical migration phenomena. This document does not cover non-electrically-driven diffusion phenomena nor stress-induced whisker growth. | |
| language | English | |
| title | IPC TR-476A | num |
| title | Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies | en |
| type | standard | |
| page | 68 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1997 | |
| contenttype | fulltext |