• 0
    • ارسال درخواست
    • حذف همه
    • Industrial Standards
    • Defence Standards
  • درباره ما
  • درخواست موردی
  • فهرست استانداردها
    • Industrial Standards
    • Defence Standards
  • راهنما
  • Login
  • لیست خرید شما 0
    • ارسال درخواست
    • حذف همه
View Item 
  •   YSE
  • Industrial Standards
  • IPC - Association Connecting Electronics Industries
  • View Item
  •   YSE
  • Industrial Standards
  • IPC - Association Connecting Electronics Industries
  • View Item
  • All Fields
  • Title(or Doc Num)
  • Organization
  • Year
  • Subject
Advanced Search
JavaScript is disabled for your browser. Some features of this site may not work without it.

Archive

IPC 6012C

Qualification and Performance Specification for Rigid Printed Boards

Organization:
IPC - Association Connecting Electronics Industries
Year: 2010

Abstract: Statement of Scope This specification establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards.
Purpose The purpose of this specification is to provide requirements for qualification and performance of rigid printed boards based on the following constructions and/or technologies:
• Single-sided, double-sided printed boards with or without plated-through holes (PTHs).
• Multilayer printed boards with PTHs with or without buried/blind vias.
• Multilayer printed boards containing build up High Density Interconnect (HDI) layers conforming to IPC-6016.
• Active embedded passive circuitry printed boards with distributive capacitive planes and/or capacitive or resistive components.
• Metal core printed boards with or without an external metal heat frame, which may be active or nonactive.
URI: https://lib.yabesh.ir/std/handle/yse/124475
Collections :
  • IPC - Association Connecting Electronics Industries
  • Download PDF : (1.983Mb)
  • Show Full MetaData Hide Full MetaData
  • Statistics

    IPC 6012C

Show full item record

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:00:58Z
date available2017-09-04T17:00:58Z
date copyright04/01/2010
date issued2010
identifier otherXQCNQCAAAAAAAAAA.pdf
identifier urihttps://lib.yabesh.ir/std/handle/yse/124475
description abstractStatement of Scope This specification establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards.
Purpose The purpose of this specification is to provide requirements for qualification and performance of rigid printed boards based on the following constructions and/or technologies:
• Single-sided, double-sided printed boards with or without plated-through holes (PTHs).
• Multilayer printed boards with PTHs with or without buried/blind vias.
• Multilayer printed boards containing build up High Density Interconnect (HDI) layers conforming to IPC-6016.
• Active embedded passive circuitry printed boards with distributive capacitive planes and/or capacitive or resistive components.
• Metal core printed boards with or without an external metal heat frame, which may be active or nonactive.
languageEnglish
titleIPC 6012Cnum
titleQualification and Performance Specification for Rigid Printed Boardsen
typestandard
page60
statusActive
treeIPC - Association Connecting Electronics Industries:;2010
contenttypefulltext
DSpace software copyright © 2017-2020  DuraSpace
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
yabeshDSpacePersian
 
DSpace software copyright © 2017-2020  DuraSpace
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
yabeshDSpacePersian