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IPC 7093

Design and Assembly Process Implementation for Bottom Termination Components

Organization:
IPC - Association Connecting Electronics Industries
Year: 2011

Abstract: This document describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body. Throughout this document the word "BTC" can mean all types and forms of bottom only termination components intended for surface-mounting. This includes such industry descriptive nomenclature as QFN, DFN, SON, LGA, MLP, and MLF, which utilize surface to surface interconnections. The focus of the information contained herein is on critical design, assembly, inspection, repair, and reliability issues associated with BTCs.
Purpose The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, inspection, and repair processes. The intent is to provide useful and practical information to those companies who are using or considering tin/lead, lead-free, adhesives or other forms of interconnection processes for assembly of BTC type components.
URI: https://lib.yabesh.ir/std/handle/yse/125564
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contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:02:05Z
date available2017-09-04T17:02:05Z
date copyright03/01/2011
date issued2011
identifier otherXTBCFEAAAAAAAAAA.pdf
identifier urihttps://lib.yabesh.ir/std/handle/yse/125564
description abstractThis document describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body. Throughout this document the word "BTC" can mean all types and forms of bottom only termination components intended for surface-mounting. This includes such industry descriptive nomenclature as QFN, DFN, SON, LGA, MLP, and MLF, which utilize surface to surface interconnections. The focus of the information contained herein is on critical design, assembly, inspection, repair, and reliability issues associated with BTCs.
Purpose The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, inspection, and repair processes. The intent is to provide useful and practical information to those companies who are using or considering tin/lead, lead-free, adhesives or other forms of interconnection processes for assembly of BTC type components.
languageEnglish
titleIPC 7093num
titleDesign and Assembly Process Implementation for Bottom Termination Componentsen
typestandard
page124
statusActive
treeIPC - Association Connecting Electronics Industries:;2011
contenttypefulltext
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