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IPC 7093
Design and Assembly Process Implementation for Bottom Termination Components
Organization:
IPC - Association Connecting Electronics Industries
Year: 2011
Abstract: This document describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body. Throughout this document the word "BTC" can mean all types and forms of bottom only termination components intended for surface-mounting. This includes such industry descriptive nomenclature as QFN, DFN, SON, LGA, MLP, and MLF, which utilize surface to surface interconnections. The focus of the information contained herein is on critical design, assembly, inspection, repair, and reliability issues associated with BTCs.
Purpose The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, inspection, and repair processes. The intent is to provide useful and practical information to those companies who are using or considering tin/lead, lead-free, adhesives or other forms of interconnection processes for assembly of BTC type components.
Purpose The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, inspection, and repair processes. The intent is to provide useful and practical information to those companies who are using or considering tin/lead, lead-free, adhesives or other forms of interconnection processes for assembly of BTC type components.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:02:05Z | |
| date available | 2017-09-04T17:02:05Z | |
| date copyright | 03/01/2011 | |
| date issued | 2011 | |
| identifier other | XTBCFEAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/125564 | |
| description abstract | This document describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body. Throughout this document the word "BTC" can mean all types and forms of bottom only termination components intended for surface-mounting. This includes such industry descriptive nomenclature as QFN, DFN, SON, LGA, MLP, and MLF, which utilize surface to surface interconnections. The focus of the information contained herein is on critical design, assembly, inspection, repair, and reliability issues associated with BTCs. Purpose The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, inspection, and repair processes. The intent is to provide useful and practical information to those companies who are using or considering tin/lead, lead-free, adhesives or other forms of interconnection processes for assembly of BTC type components. | |
| language | English | |
| title | IPC 7093 | num |
| title | Design and Assembly Process Implementation for Bottom Termination Components | en |
| type | standard | |
| page | 124 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2011 | |
| contenttype | fulltext |