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IPC J-STD-001F
Requirements for Soldered Electrical and Electronic Assemblies
Organization:
IPC - Association Connecting Electronics Industries
Year: 2014
Abstract: This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. For a more complete understanding of this document's recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001 and IPC-A-610.
Purpose This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this standard to exclude any procedure for component placement or for applying flux and solder used to make the electrical connection.
Purpose This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this standard to exclude any procedure for component placement or for applying flux and solder used to make the electrical connection.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:04:15Z | |
| date available | 2017-09-04T17:04:15Z | |
| date copyright | 2014.07.01 | |
| date issued | 2014 | |
| identifier other | XZGMIFAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/127869 | |
| description abstract | This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. For a more complete understanding of this document's recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001 and IPC-A-610. Purpose This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this standard to exclude any procedure for component placement or for applying flux and solder used to make the electrical connection. | |
| language | English | |
| title | IPC J-STD-001F | num |
| title | Requirements for Soldered Electrical and Electronic Assemblies | en |
| type | standard | |
| page | 84 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2014 | |
| contenttype | fulltext |