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IPC TM-650 2.4.18.1A
Tensile Strength and Elongation, In-House Plating
Organization:
IPC - Association Connecting Electronics Industries
Year: 2004
Abstract: To determine the tensile strength in Mpa (PSI) and the elongation, in percentage, of electrodeposited copper plating at ambient temperatures by mechanical force testing.
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IPC TM-650 2.4.18.1A
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:04:22Z | |
| date available | 2017-09-04T17:04:22Z | |
| date copyright | 05/01/2004 | |
| date issued | 2004 | |
| identifier other | XZOHFBAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/127975 | |
| description abstract | To determine the tensile strength in Mpa (PSI) and the elongation, in percentage, of electrodeposited copper plating at ambient temperatures by mechanical force testing. | |
| language | English | |
| title | IPC TM-650 2.4.18.1A | num |
| title | Tensile Strength and Elongation, In-House Plating | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |