IPC 9641

High Temperature Printed Board Flatness Guideline

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T17:04:45Z
date available	2017-09-04T17:04:45Z
date copyright	06/01/2013
date issued	2013
identifier other	YAQDFFAAAAAAAAAA.pdf
identifier uri	https://lib.yabesh.ir/std/handle/yse/128336
description abstract	The purpose of this test method is to measure the shape and relative change in shape of a local area of interest (e.g., flip-chip ball grid array (FCBGA) land area) of printed boards through a range of temperatures typical during surface mount and through-hole builds of integrated circuit packages to printed boards. The use of shape measurements and relative changes in shape will depend on the specific application and interest of the user performing the measurement. This guideline differs from and does not supersede IPC-TM-650, Method 2.4.22, which is used for inspection of bow and/or twist of bare printed boards at room temperature.
language	English
title	IPC 9641	num
title	High Temperature Printed Board Flatness Guideline	en
type	standard
page	32
status	Active
tree	IPC - Association Connecting Electronics Industries:;2013
contenttype	fulltext