درباره ما
IPC 9641
High Temperature Printed Board Flatness Guideline
Organization:
IPC - Association Connecting Electronics Industries
Year: 2013
Abstract: The purpose of this test method is to measure the shape and relative change in shape of a local area of interest (e.g., flip-chip ball grid array (FCBGA) land area) of printed boards through a range of temperatures typical during surface mount and through-hole builds of integrated circuit packages to printed boards. The use of shape measurements and relative changes in shape will depend on the specific application and interest of the user performing the measurement. This guideline differs from and does not supersede IPC-TM-650, Method 2.4.22, which is used for inspection of bow and/or twist of bare printed boards at room temperature.
Collections
:
Show full item record
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:04:45Z | |
| date available | 2017-09-04T17:04:45Z | |
| date copyright | 06/01/2013 | |
| date issued | 2013 | |
| identifier other | YAQDFFAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/128336 | |
| description abstract | The purpose of this test method is to measure the shape and relative change in shape of a local area of interest (e.g., flip-chip ball grid array (FCBGA) land area) of printed boards through a range of temperatures typical during surface mount and through-hole builds of integrated circuit packages to printed boards. The use of shape measurements and relative changes in shape will depend on the specific application and interest of the user performing the measurement. This guideline differs from and does not supersede IPC-TM-650, Method 2.4.22, which is used for inspection of bow and/or twist of bare printed boards at room temperature. | |
| language | English | |
| title | IPC 9641 | num |
| title | High Temperature Printed Board Flatness Guideline | en |
| type | standard | |
| page | 32 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2013 | |
| contenttype | fulltext |