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IPC IPC/JEDEC-9707
Spherical Bend Test Method for Characterization of Board Level Interconnects
Organization:
IPC - Association Connecting Electronics Industries
Year: 2011
Abstract: This standard specifies a common method of establishing strain limits of board-level device interconnects under spherical bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly, manufacturing, and test operations. This method is applicable to surface mounted Ball Grid Array (BGA) components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. While it is possible to test alternate or smaller packages, some of the tests may need to be modified. Spherical bend test pass/fail requirements are typically specific to each device application and are outside the scope of this document. Applicability of this test method and its associated parameters should be based on expected manufacturing conditions.
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IPC IPC/JEDEC-9707
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:11:28Z | |
| date available | 2017-09-04T17:11:28Z | |
| date copyright | 09/01/2011 | |
| date issued | 2011 | |
| identifier other | YSTJNEAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/135044 | |
| description abstract | This standard specifies a common method of establishing strain limits of board-level device interconnects under spherical bending conditions, the worst-case flexure condition that can occur during conventional printed board/system assembly, manufacturing, and test operations. This method is applicable to surface mounted Ball Grid Array (BGA) components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. While it is possible to test alternate or smaller packages, some of the tests may need to be modified. Spherical bend test pass/fail requirements are typically specific to each device application and are outside the scope of this document. Applicability of this test method and its associated parameters should be based on expected manufacturing conditions. | |
| language | English | |
| title | IPC IPC/JEDEC-9707 | num |
| title | Spherical Bend Test Method for Characterization of Board Level Interconnects | en |
| type | standard | |
| page | 24 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2011 | |
| contenttype | fulltext |