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IPC TM-650 2.6.3.3B
Surface Insulation Resistance, Fluxes
Organization:
IPC - Association Connecting Electronics Industries
Year: 2004
Abstract: This test method is to characterize fluxes by determining the degradation of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. This test is carried out at high humidity and heat conditions.
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IPC TM-650 2.6.3.3B
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:12:27Z | |
| date available | 2017-09-04T17:12:27Z | |
| date copyright | 06/01/2004 | |
| date issued | 2004 | |
| identifier other | YVKGIBAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/135955 | |
| description abstract | This test method is to characterize fluxes by determining the degradation of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. This test is carried out at high humidity and heat conditions. | |
| language | English | |
| title | IPC TM-650 2.6.3.3B | num |
| title | Surface Insulation Resistance, Fluxes | en |
| type | standard | |
| page | 4 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |