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IPC TM-650 2.4.51
Self Shimming Thermally Conductive Adhesives
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: To determine dispersion of glass microbeads in Self Shimming Thermally Conductive Adhesives, thus ensuring the proper self-induced gap. It is important for the beads to be well dispersed throughout the batch, since this adhesive is designed for bonding of electrical components to printed circuit boards where electrical isolation, provided by a consistent gap, is required. The testing is performed by measuring the gap induced by the adhesive placed between two flat metal surfaces.
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IPC TM-650 2.4.51
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:17:08Z | |
| date available | 2017-09-04T17:17:08Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | CBRUCAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/140612 | |
| description abstract | To determine dispersion of glass microbeads in Self Shimming Thermally Conductive Adhesives, thus ensuring the proper self-induced gap. It is important for the beads to be well dispersed throughout the batch, since this adhesive is designed for bonding of electrical components to printed circuit boards where electrical isolation, provided by a consistent gap, is required. The testing is performed by measuring the gap induced by the adhesive placed between two flat metal surfaces. | |
| language | English | |
| title | IPC TM-650 2.4.51 | num |
| title | Self Shimming Thermally Conductive Adhesives | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |