IPC TR-462

Solderability Evaluation of Printed Boards with Protective Coatings over a Long Term Storage

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T17:18:03Z
date available	2017-09-04T17:18:03Z
date copyright	32051
date issued	1987
identifier other	ZJXLCAAAAAAAAAAA.pdf
identifier uri	https://lib.yabesh.ir/std/handle/yse/141410
description abstract	The Round Robin Test Program had the following objectives. Determine the effectiveness of different protective coatings, and methods of coating application, on printed wiring boards. Coatings were to be applied over a variety of conductor patterns, land configurations, plated and nonplated holes, on PWBs with and without solder mask. Provide insight into PWB solderability after various time periods in typical storage conditions, and correlate this data with the thickness and characteristics of the coating. Determine if various patterns of conductors, lands, spacing and configuration contributed to the soldering characteristics.
language	English
title	IPC TR-462	num
title	Solderability Evaluation of Printed Boards with Protective Coatings over a Long Term Storage	en
type	standard
page	74
status	Active
tree	IPC - Association Connecting Electronics Industries:;1987
contenttype	fulltext