IPC TR-462
Solderability Evaluation of Printed Boards with Protective Coatings over a Long Term Storage
Organization:
IPC - Association Connecting Electronics Industries
Year: 1987
Abstract: The Round Robin Test Program had the following objectives. Determine the effectiveness of different protective coatings, and methods of coating application, on printed wiring boards. Coatings were to be applied over a variety of conductor patterns, land configurations, plated and nonplated holes, on PWBs with and without solder mask. Provide insight into PWB solderability after various time periods in typical storage conditions, and correlate this data with the thickness and characteristics of the coating. Determine if various patterns of conductors, lands, spacing and configuration contributed to the soldering characteristics.
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contributor author | IPC - Association Connecting Electronics Industries | |
date accessioned | 2017-09-04T17:18:03Z | |
date available | 2017-09-04T17:18:03Z | |
date copyright | 32051 | |
date issued | 1987 | |
identifier other | ZJXLCAAAAAAAAAAA.pdf | |
identifier uri | https://lib.yabesh.ir/std/handle/yse/141410 | |
description abstract | The Round Robin Test Program had the following objectives. Determine the effectiveness of different protective coatings, and methods of coating application, on printed wiring boards. Coatings were to be applied over a variety of conductor patterns, land configurations, plated and nonplated holes, on PWBs with and without solder mask. Provide insight into PWB solderability after various time periods in typical storage conditions, and correlate this data with the thickness and characteristics of the coating. Determine if various patterns of conductors, lands, spacing and configuration contributed to the soldering characteristics. | |
language | English | |
title | IPC TR-462 | num |
title | Solderability Evaluation of Printed Boards with Protective Coatings over a Long Term Storage | en |
type | standard | |
page | 74 | |
status | Active | |
tree | IPC - Association Connecting Electronics Industries:;1987 | |
contenttype | fulltext |