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IPC 6015
Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures
Organization:
IPC - Association Connecting Electronics Industries
Year: 1998
Abstract: This specification establishes the specific requirements for the organic mounting structure used to interconnect chip components, which in combination form the completed functional Organic Single-chip Module (SCM-L) or Organic Multichip Module (MCM-L) assembly, and the quality and reliability assurance requirements that must be met for their acquisition.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:18:27Z | |
| date available | 2017-09-04T17:18:27Z | |
| date copyright | 02/01/1998 | |
| date issued | 1998 | |
| identifier other | ZKYHCAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/141794 | |
| description abstract | This specification establishes the specific requirements for the organic mounting structure used to interconnect chip components, which in combination form the completed functional Organic Single-chip Module (SCM-L) or Organic Multichip Module (MCM-L) assembly, and the quality and reliability assurance requirements that must be met for their acquisition. | |
| language | English | |
| title | IPC 6015 | num |
| title | Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures | en |
| type | standard | |
| page | 32 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1998 | |
| contenttype | fulltext |