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IPC J-STD-001E
Requirements for Soldered Electrical and Electronic Assemblies
Organization:
IPC - Association Connecting Electronics Industries
Year: 2010
Abstract: This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial addressing principles and techniques. For a more complete understanding of this document's recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-A-610 and IPC-HDBK-610.
Purpose
This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this standard to exclude any procedure for component placement or for applying flux and solder used to make the electrical connection.
Purpose
This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this standard to exclude any procedure for component placement or for applying flux and solder used to make the electrical connection.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:19:38Z | |
| date available | 2017-09-04T17:19:38Z | |
| date copyright | 04/01/2010 | |
| date issued | 2010 | |
| identifier other | ZNXMQCAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/142865 | |
| description abstract | This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial addressing principles and techniques. For a more complete understanding of this document's recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-A-610 and IPC-HDBK-610. Purpose This standard describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this standard to exclude any procedure for component placement or for applying flux and solder used to make the electrical connection. | |
| language | English | |
| title | IPC J-STD-001E | num |
| title | Requirements for Soldered Electrical and Electronic Assemblies | en |
| type | standard | |
| page | 72 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2010 | |
| contenttype | fulltext |