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IPC TM-650 2.4.45
Solder Paste - Wetting Test
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: Determine the ability of a solder paste to wet an oxidized copper surface and to qualitatively examine the amount of spatter of the solder paste during reflow.
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IPC TM-650 2.4.45
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:23:23Z | |
| date available | 2017-09-04T17:23:23Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | ZYXICAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/146629 | |
| description abstract | Determine the ability of a solder paste to wet an oxidized copper surface and to qualitatively examine the amount of spatter of the solder paste during reflow. | |
| language | English | |
| title | IPC TM-650 2.4.45 | num |
| title | Solder Paste - Wetting Test | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |