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IPC CA-821
General Requirements for Thermally Conductive Adhesives
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: This document covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for their long term properties as a part of the printed wiring board.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:27:21Z | |
| date available | 2017-09-04T17:27:21Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | CMVICAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/150505 | |
| description abstract | This document covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for their long term properties as a part of the printed wiring board. | |
| language | English | |
| title | IPC CA-821 | num |
| title | General Requirements for Thermally Conductive Adhesives | en |
| type | standard | |
| page | 17 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |