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Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards - Incorporates Amendments 1 & 2

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:29:43Z
date available2017-09-04T17:29:43Z
date copyright41244
date issued2012
identifier otherCSXWDFAAAAAAAAAA.pdf
identifier urihttps://lib.yabesh.ir/std/handle/yse/152778
description abstractThis specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by supplier, printed circuit manufacturer, electronics manufacturing services (EMS) and original equipment manufacturer (OEM).
languageEnglish
titleIPC 4552num
titleSpecification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards - Incorporates Amendments 1 & 2en
typestandard
page40
statusActive
treeIPC - Association Connecting Electronics Industries:;2012
contenttypefulltext


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