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IPC 4552
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards - Incorporates Amendments 1 & 2
Organization:
IPC - Association Connecting Electronics Industries
Year: 2012
Abstract: This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by supplier, printed circuit manufacturer, electronics manufacturing services (EMS) and original equipment manufacturer (OEM).
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:29:43Z | |
| date available | 2017-09-04T17:29:43Z | |
| date copyright | 41244 | |
| date issued | 2012 | |
| identifier other | CSXWDFAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/152778 | |
| description abstract | This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by supplier, printed circuit manufacturer, electronics manufacturing services (EMS) and original equipment manufacturer (OEM). | |
| language | English | |
| title | IPC 4552 | num |
| title | Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards - Incorporates Amendments 1 & 2 | en |
| type | standard | |
| page | 40 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2012 | |
| contenttype | fulltext |