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IPC IPC/JPCA-6801
Terms and Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 2000
Abstract: This standard specifies printed wiring boards (PWBs) manufactured by the build-up process used primarily for electronic equipment (hereinafter build-up/high density interconnect (HDI) PWBs). The build-up/HDI PWB, as referred to herein, is defined as the printed board that is built up progressively with the conductor layers and insulating layers using techniques such as plating and printing. The build-up/HDI PWBs include substrates for semiconductor packages.
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IPC IPC/JPCA-6801
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:39:20Z | |
| date available | 2017-09-04T17:39:20Z | |
| date copyright | 01/01/2000 | |
| date issued | 2000 | |
| identifier other | DSGDKAAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/162268 | |
| description abstract | This standard specifies printed wiring boards (PWBs) manufactured by the build-up process used primarily for electronic equipment (hereinafter build-up/high density interconnect (HDI) PWBs). The build-up/HDI PWB, as referred to herein, is defined as the printed board that is built up progressively with the conductor layers and insulating layers using techniques such as plating and printing. The build-up/HDI PWBs include substrates for semiconductor packages. | |
| language | English | |
| title | IPC IPC/JPCA-6801 | num |
| title | Terms and Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnect (HDI) Printed Wiring Boards | en |
| type | standard | |
| page | 41 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2000 | |
| contenttype | fulltext |