JEDEC JEP154

Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T18:02:31Z
date available	2017-09-04T18:02:31Z
date copyright	01/01/2008
date issued	2008
identifier other	GCDJCCAAAAAAAAAA.pdf
identifier uri	https://lib.yabesh.ir/std/handle/yse/185559
description abstract	This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis.
language	English
title	JEDEC JEP154	num
title	Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress	en
type	standard
page	30
status	Active
tree	JEDEC - Solid State Technology Association:;2008
contenttype	fulltext
subject keywords	pro