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JEDEC JEP154
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
Organization:
JEDEC - Solid State Technology Association
Year: 2008
Abstract: This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis.
Subject: pro
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| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T18:02:31Z | |
| date available | 2017-09-04T18:02:31Z | |
| date copyright | 01/01/2008 | |
| date issued | 2008 | |
| identifier other | GCDJCCAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/185559 | |
| description abstract | This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis. | |
| language | English | |
| title | JEDEC JEP154 | num |
| title | Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress | en |
| type | standard | |
| page | 30 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2008 | |
| contenttype | fulltext | |
| subject keywords | pro |