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Procedure for Characterizing Time- Dependent Dielectric Breakdown of Ultra-Thin Gate Dielectrics

contributor authorJEDEC - Solid State Technology Association
date accessioned2017-09-04T18:08:38Z
date available2017-09-04T18:08:38Z
date copyright08/01/2003
date issued2003
identifier otherGSEWDBAAAAAAAAAA.pdf
identifier urihttps://lib.yabesh.ir/std/handle/yse/191597
description abstractThis document defines a constant voltage stress test procedure for characterizing time-dependent dielectric breakdown or Â"wear-outÂ" of thin gate dielectrics used in integrated circuit technologies. The test is designed to obtain voltage and temperature acceleration parameters required to estimate oxide life at use conditions. The test procedure includes sophisticated techniques to detect breakdown in ultra-thin films that typically exhibit large tunneling currents and soft or noisy breakdown characteristics. This document includes an annex that discusses test structure design, methods to determine the oxide electric field in ultra-thin films, statistical models, extrapolation models, and example failure-rate calculations.
languageEnglish
titleJEDEC JESD92num
titleProcedure for Characterizing Time- Dependent Dielectric Breakdown of Ultra-Thin Gate Dielectricsen
typestandard
page32
statusActive
treeJEDEC - Solid State Technology Association:;2003
contenttypefulltext
subject keywordsDIELECTRIC BREAKDOWN
subject keywordsGATE DIELECTRICS
subject keywordsTIME-DEPENDENT
subject keywordsULTRA-THIN


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