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IPC TM-650 2.3.4.2A

Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure

Organization:
IPC - Association Connecting Electronics Industries
Year: 1994

Abstract: This method is designed to evaluate the resistance of dielectric materials to organic chemicals representative of those used in printed board fabrication and assembly. It is intended to provide a distinction between materials of varying chemical resistance and, when applicable, an indication of the degree of cure.
URI: https://lib.yabesh.ir/std/handle/yse/194982
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  • IPC - Association Connecting Electronics Industries
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    IPC TM-650 2.3.4.2A

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contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:11:58Z
date available2017-09-04T18:11:58Z
date copyright34669
date issued1994
identifier otherHBFICAAAAAAAAAAA.pdf
identifier urihttps://lib.yabesh.ir/std/handle/yse/194982
description abstractThis method is designed to evaluate the resistance of dielectric materials to organic chemicals representative of those used in printed board fabrication and assembly. It is intended to provide a distinction between materials of varying chemical resistance and, when applicable, an indication of the degree of cure.
languageEnglish
titleIPC TM-650 2.3.4.2Anum
titleChemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposureen
typestandard
page4
statusActive
treeIPC - Association Connecting Electronics Industries:;1994
contenttypefulltext
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