IPC TM-650 2.3.4.2A
Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure
Organization:
IPC - Association Connecting Electronics Industries
Year: 1994
Abstract: This method is designed to evaluate the resistance of dielectric materials to organic chemicals representative of those used in printed board fabrication and assembly. It is intended to provide a distinction between materials of varying chemical resistance and, when applicable, an indication of the degree of cure.
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IPC TM-650 2.3.4.2A
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contributor author | IPC - Association Connecting Electronics Industries | |
date accessioned | 2017-09-04T18:11:58Z | |
date available | 2017-09-04T18:11:58Z | |
date copyright | 34669 | |
date issued | 1994 | |
identifier other | HBFICAAAAAAAAAAA.pdf | |
identifier uri | https://lib.yabesh.ir/std/handle/yse/194982 | |
description abstract | This method is designed to evaluate the resistance of dielectric materials to organic chemicals representative of those used in printed board fabrication and assembly. It is intended to provide a distinction between materials of varying chemical resistance and, when applicable, an indication of the degree of cure. | |
language | English | |
title | IPC TM-650 2.3.4.2A | num |
title | Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure | en |
type | standard | |
page | 4 | |
status | Active | |
tree | IPC - Association Connecting Electronics Industries:;1994 | |
contenttype | fulltext |