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IPC TM-650 2.4.36C
Rework Simulation, Plated-Through Holes for Leaded Components
Organization:
IPC - Association Connecting Electronics Industries
Year: 2004
Abstract: This test method is used to simulate the procedures for plated-through hole (PTH) component removal and replacement, in order to determine the effects of rework on the quality and integrity of the PTH barrel and conductor foil on bare rigid or flexible printed boards. The five steps are designed to simulate initial soldering after a preconditioning bake and two subsequent replacements.
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IPC TM-650 2.4.36C
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:12:29Z | |
| date available | 2017-09-04T18:12:29Z | |
| date copyright | 05/01/2004 | |
| date issued | 2004 | |
| identifier other | HCPHFBAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/195478 | |
| description abstract | This test method is used to simulate the procedures for plated-through hole (PTH) component removal and replacement, in order to determine the effects of rework on the quality and integrity of the PTH barrel and conductor foil on bare rigid or flexible printed boards. The five steps are designed to simulate initial soldering after a preconditioning bake and two subsequent replacements. | |
| language | English | |
| title | IPC TM-650 2.4.36C | num |
| title | Rework Simulation, Plated-Through Holes for Leaded Components | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2004 | |
| contenttype | fulltext |