IPC 6013B

Abstract

<strong>Statement of Scope</strong> This specification covers qualification and performance requirements of flexible printed boards (PBs). The flexible PB may be single-sided, doublesided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, platedthrough holes (PTHs), and blind/buried vias. <br>The flexible or rigid-flex PB may contain build up high density interconnect (HDI) layers conforming to IPC-6016. The PB may contain active embedded passive circuitry with distributive capacitive planes, capacitive or resistive components. <br>The rigid section of the PB may contain a metal core or external metal heat frame, which may be active or nonactive. <br>Revision level changes are described in 1.7. <br><strong>Purpose</strong> The purpose of this specification is to provide requirements for qualification and performance of flexible PBs designed to IPC-2221 and IPC-2223.