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IPC 6013B
Qualification and Performance Specification for Flexible Printed Boards
Organization:
IPC - Association Connecting Electronics Industries
Year: 2009
Abstract: Statement of Scope This specification covers qualification and performance requirements of flexible printed boards (PBs). The flexible PB may be single-sided, doublesided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, platedthrough holes (PTHs), and blind/buried vias.
The flexible or rigid-flex PB may contain build up high density interconnect (HDI) layers conforming to IPC-6016. The PB may contain active embedded passive circuitry with distributive capacitive planes, capacitive or resistive components.
The rigid section of the PB may contain a metal core or external metal heat frame, which may be active or nonactive.
Revision level changes are described in 1.7.
Purpose The purpose of this specification is to provide requirements for qualification and performance of flexible PBs designed to IPC-2221 and IPC-2223.
The flexible or rigid-flex PB may contain build up high density interconnect (HDI) layers conforming to IPC-6016. The PB may contain active embedded passive circuitry with distributive capacitive planes, capacitive or resistive components.
The rigid section of the PB may contain a metal core or external metal heat frame, which may be active or nonactive.
Revision level changes are described in 1.7.
Purpose The purpose of this specification is to provide requirements for qualification and performance of flexible PBs designed to IPC-2221 and IPC-2223.
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:16:38Z | |
| date available | 2017-09-04T18:16:38Z | |
| date copyright | 01/01/2009 | |
| date issued | 2009 | |
| identifier other | HNIKLCAAAAAAAAAA.pdf | |
| identifier uri | https://lib.yabesh.ir/std/handle/yse/199548 | |
| description abstract | Statement of Scope This specification covers qualification and performance requirements of flexible printed boards (PBs). The flexible PB may be single-sided, doublesided, multilayer, or rigid-flex multilayer. All of these constructions may or may not include stiffeners, platedthrough holes (PTHs), and blind/buried vias. The flexible or rigid-flex PB may contain build up high density interconnect (HDI) layers conforming to IPC-6016. The PB may contain active embedded passive circuitry with distributive capacitive planes, capacitive or resistive components. The rigid section of the PB may contain a metal core or external metal heat frame, which may be active or nonactive. Revision level changes are described in 1.7. Purpose The purpose of this specification is to provide requirements for qualification and performance of flexible PBs designed to IPC-2221 and IPC-2223. | |
| language | English | |
| title | IPC 6013B | num |
| title | Qualification and Performance Specification for Flexible Printed Boards | en |
| type | standard | |
| page | 60 | |
| status | Revised | |
| tree | IPC - Association Connecting Electronics Industries:;2009 | |
| contenttype | fulltext |